IC DeCapsulation
The Process
Our Decapsulation processes use the latest techniques to decapsulate all types of plastic encapsulated parts in order to expose the die in today's integrated circuits (IC). This procedure is done so that analysis testing and probing can be carried out the IC after the decapsulation.
Decapsulation exposes the integrated circuit for ussually for the purpose of direct probe connection to the silicon die. Various techniques have been developed to achieve this, suitable methods are selected to be compatible with the particular packaging configuration in order to minimize complications from introduction of foreign matter or damage to the silicon device.
Some de-capsulation techniques are as basic as breaking a package open or heating to melt the encapsulant, these are NOT recommended.
Chemical removal of polymeric encapsulating material with acid, or mixtures of acids and solvents, is a very common method that gives good results if carried out correctly. However the acids involved are used in a concentrated form and significant health and safety issues are associated with this methodology.
We favour the use of a proprietary mix of organic solvents, formulated to breakdown the molecular bonds within the encapsulant without damage to the die or bond wires, resulting in a very clean die, with reduced health and safety issues and a non aggressive action on the exposed die and bond wires.
Once the die is electrically accessible via any of the aforementioned methods, micro positioners can be utilised to attach probes to the bond wires or bond pads to provide a low impedance connection to the silicon chip.
Example DeCapsulation
